Upgraded processor - Need advice

I just replaced the processor in a Dell Dimension XPS T450

Pentium III 800MHz Slot1 from Pentium III 450MHz

I took the heat sink off the 450 and put it against the 800 using the black plastic pegs that were with the original heat sink.

I did not use any glue (heat-transfer-goo) that I have seen on some websites that describe computer building.

The black plastic pegs appear to hold the old heat sink securely against the new processor, but I am wondering if I should try to find that glue and open up the computer and put some between the processor and the heat sink.

Will the glue help a lot and save me trouble down the road? Or will the processor transfer heat efficiently without the glue?

This computer is not used heavily (gaming), it is simply a household computer that is used for kids games and word processing.

 

No matter what you use it for you will need that "glue" (thermal paste) If you're not worrying about temps then any sort of generic thermal paste should work

 

Thank you, I appreciate the help.

 

Not really true... I've got 2 Slot 1 Pentium 3s and neither have had any thermal paste/pads. The heatsink is just flat on the processor die. Have been running like this since 1999.

 

lol wyatt i love how u always contradict me (and usually for the good of the poster lol) and yea, i believe you're correct; my old p2 doesnt have any either

 

I thought XPSs were those top-notch laptops.... with a P3 :| I'm certain you'll need it to be glued.

 

Are you sure that laptops use the Slot 1 processors!

 

It is not a laptop...

http://www.amazon.com/exec/obidos/tg/detail/-/B00005UJYT?v=glance

I actually didn't know that Dell had used the "XPS" model name previously. I thought it was a new thing... You learn something everyday.

Well, I'm glad you don't take offense to it. I'm just trying to help.

 

P3's dont get terribly hot. Many of them still ran passive heatsinks as they did not generate too much heat.

Its always a good idea to use thermal compound (slightly different than actual thermal paste, which bonds two pieces together-- while compound just creates a thermal seal) for the just in case, but you might not need it